siemens: Siemens uses advanced packaging software to automate design process for testing new chips 

Siemens Digital Industries Software, a unit of Siemens AG said it launched new software called Tessent Multi-die that automates a design process for testing chips made with advanced packaging.

While chips have traditionally been packaged with one silicon tile inside, as the industry faces challenges making features on these tiles smaller and smaller to cram more computing power into them, companies including Intel are starting to stack several of them, sometimes mixing and matching different technologies, to improve performance.

Read Also

China "large space" for data center chips despite US restrictions: Nvidia CEO

Chipmaker Nvidia launches new system for autonomous driving

But testing these chips after they are made has been difficult as there are several layers of tiles, and Siemens' head of the Tessent business Ankur Gupta said until now Siemens has had to work with customers on a case-by-case basis.

Testing is a key part of the chip-making process and a port to test them has to be designed into the chip before they are made.

"What we are doing now is taking all of those learnings and automating the solution, making it available general purpose for everybody to use," Gupta said.

He said making the testing process easier for chips with advanced packaging, also referred to as 2.5 and 3-dimensional packaging, will help give the new technology a boost.

( Details and picture courtesy from Source, the content is auto-generated from RSS feed.)

Join our official telegram channel for free latest updates and follow us on Google News here.